亚新官方网站-亚新(中国)
PRODUCT TECHNOLOGY
技术路线
产品服务
Package List

Package Type

Package Size
Ball/Lead Pitch
Ball Size

60B wBGA

8x10x1.2(Max.)

0.8mm

0.45mm

8x10.5x1.2(Max.)

0.8mm

0.45mm

9x11.5x1.2(Max.)

0.8mm

0.45mm

84B wBGA

8x12.5x1.2(Max.)

0.8mm

0.45mm

Package Type Package Size Ball Size Ball/Lead pitch

78B wBGA

7.5x11x1.2(Max.)

0.45mm

0.8mm

8x10.5x1.2(Max.)

0.45mm

0.8mm

9x10.5x1.2(Max.)

0.45mm

0.8mm

9x11.1X1.2(Max.)

0.45mm

0.8mm

9.4x11.1X1.2(Max.)

0.45mm

0.8mm

10.5x12x1.2(Max.)

0.45mm

0.8mm

78B FCBGA

9x10.5x1.2(Max.)

0.45mm

0.8mm

96B wBGA

9x13x1.2(Max.)

0.45mm

0.8mm

Package Type

Package Size

Ball Size

Ball/Lead pitch

78B wBGA

8x12x1.2(Max.)

0.45mm

0.8mm

9x10.5x1.2(Max.)

0.45mm

0.8mm

78B wBGA

9x13x1.2(Max.)

0.45mm

0.8mm

9x14x1.2(Max.)

0.45mm

0.8mm

Product Type

Package Type

Package Size

Ball Size

Ball/Lead pitch

LPDDR2

162B FBGA

12x12x1.1(Max.)

0.3/0.35mm

0.5mm

LPDDR4

200B FBGA

10x14.5x0.85(Max.)

0.3mm

0.8x0.65mm

Product Type Package Type Package Size Ball Size Ball/Lead pitch

eMMC

153B FBGA

11.5x13x1.0(Max.)

0.3mm

0.5mm

MCP

162B FBGA

11.5x13x1.0(Max.)

0.3mm

0.5mm

9x11.5x1.0(Max.)

0.3mm

0.5mm

8x10.5x1.0(Max.)

0.3mm

0.5mm

11.5x13x1.0(Max.)

0.3mm

0.5mm

Product   Type

Package Type

Package Size

Ball Size

Ball/Lead pitch

NAND

48 TSOP

12x18.4x1.0mm

-

0.5mm

63B FBGA

10.5x13x1.0mm

0.45mm

0.8mm

132B FBGA

12x18x1.1mm

0.45mm

1.0mm

12x18x1.4mm

13x18x1.1mm

13x18x1.4mm

152B FBGA

14x18x1.0mm

0.45mm

1.0mm

14x18x1.4mm

272B FBGA

14x18x1.4mm

0.45mm

0.8mm

UDP

11.3x24.8x1.4mm

-

-

Micro SD

11x15x1.1mm

-

-

Nano Memory

8.8x12.3x0.78mm

-

-

SIP - USB

11.1x16x1.11mm

-

-

11.1x18x1.11mm

Product Type Package Type Package Size Ball Size Ball/Lead pitch
Logic 130B FBGA 8x9x1.0/1.05(Max.) 0.30mm 0.65mm
144B FBGA 10x10x1.2(Max.) 0.35mm 0.80mm
324B FCCSP 15x15x2.0(Max.) 0.45mm 0.80mm
484B FCCSP 19x19x2.0(Max.) 0.45mm 0.80mm
Test Platform

T5831 - 1.2Gbps


Advantages
With SDBG process, high accuracy die bonder and compression mold,
TJS has full capability to provide the high stacking solutions.

8D

16D

TJS's professional Test R&D Team focus on program development, hardware design and automated integration, etc.
① Program Coding 
② Hardware Design  ->  Burn-In Board | Hifix/DSA | LoadBoard | Socket | Change Kit

③ Automation Integration


Test Platform

Package Roadmap
yuan.douglas@taijisemi.com
0512-62622592